POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks

POET Technologies Inc. ("POET" or the "Company") (NASDAQ: POET), a leader in highly integrated optical engines and light sources for AI networks, and Lumilens Inc. ("Lumilens"), an emerging leader in ...

Skymizer and VIA NEXT Collaborate to Advance Next-Generation AI Inference Infrastructure and Chiplet Integration Ecosystem

Skymizer, an AI inference infrastructure company and creator of the HyperThought™ LPU platform, today announced a strategic collaboration with VIA NEXT Technologies, a leading provider of system-level ...
Nature

Heterogeneous Integration in Advanced Packaging Technologies

Heterogeneous integration refers to the assembly of disparate semiconductor components—such as logic, memory and analogue dies—into a unified package, leveraging advanced interconnect and ...
ANTARA News

Fourier Highlights System Level Integration Shift at 2026 Advanced Liquid Cooling Technologies Conference in Taipei English

Fourier Data Center Solution Inc. ("Fourier"), a modular data center company focused on AI and HPC infrastructure, showcased ...
Semiconductor Engineering

Innovative Integration Solutions For SiP Packages Using Fan-Out Wafer Level eWLB Technology

Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to ...
Semiconductor Engineering

Advanced Packaging Design For Heterogeneous Integration

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...