Researchers from Cornell University, TSMC, and ASM used electron ptychography for atomic-scale defect inspection of transistors. The computational imaging method uses an extremely precise electron ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
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